Semiconductor package with flexible board and method of fabricat

Details Semiconductor package with flexible board and method of fabricat Semiconductor package with flexible board and method of fabricat

1997-08-15

1998-09-08

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257737, 257738, 257778, 361776, 361783, H05K 114, H05K 702, H01L 23498

Patent

active

058054227

ABSTRACT:
Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.

REFERENCES:
patent: 3427715 (1969-02-01), Mika
patent: 4922059 (1990-05-01), Walker et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5394303 (1995-02-01), Yamaji

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