Semiconductor package with ferrite shielding structure

Details Semiconductor package with ferrite shielding structure Semiconductor package with ferrite shielding structure

2006-03-24

2009-02-24

Shosho, Callie E (Department: 1794)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S737000, C257S738000, C257S753000, C257S767000, C333S012000, C361S818000, C720S650000

Reexamination Certificate

active

07495317

ABSTRACT:
A semiconductor device comprises at the wafer level one or more ferrite structures adapted to dampen high frequency noise potentially apparent at signal lines and termination points within the semiconductor device. Related methods of forming said ferrite structures are also disclosed.

REFERENCES:
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patent: 6452270 (2002-09-01), Huang
patent: 6492588 (2002-12-01), Grandy
patent: 6534708 (2003-03-01), Ono et al.
patent: 6686543 (2004-02-01), Massey
patent: 2002/0180064 (2002-12-01), Hwan et al.
patent: 2003/0218257 (2003-11-01), Ishio et al.
patent: 2005/0263680 (2005-12-01), Hirano et al.
patent: 10317596 (2004-11-01), None
patent: 01-206688 (1989-08-01), None
patent: 03-014284 (1991-01-01), None
patent: 1998-026055 (1998-07-01), None
patent: 1020000020191 (2000-04-01), None

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