Semiconductor package with enhanced electrical and thermal...

Details Semiconductor package with enhanced electrical and thermal... Semiconductor package with enhanced electrical and thermal...

2005-12-06

2005-12-06

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S124000

Reexamination Certificate

active

06972216

ABSTRACT:
A BGA (ball grid array) package with enhanced electrical and thermal performance, and a method for fabricating the BGA package, are proposed. This BGA package is characterized by the use of a power-connecting heat spreader and a ground-connecting heat spreader, which are respectively used to electrically connect power pad and ground pad to a packaged chip as well as to dissipate heat generated by the chip during operation. The ground-connecting heat spreader is arranged to entirely cover the chip, and thereby provides good shielding effect for the chip, which helps improve electrical performance of the chip during operation. Further, the ground-connecting heat spreader is partly exposed to outside of an encapsulation body that encapsulates the chip, by which satisfactory heat-dissipation efficiency can be achieved.

REFERENCES:
patent: 5851337 (1998-12-01), Chen
patent: 6599779 (2003-07-01), Shim et al.

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