Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-12-12
2006-12-12
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S111000, C438S612000, C257S666000, C257S673000
Reexamination Certificate
active
07148086
ABSTRACT:
A semiconductor package and a method of manufacturing a semiconductor package include a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plurality of solder bumps is attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps. An encapsulant encapsulates the die, the electrical connections, and the plurality of lead fingers to expose a lower surface of the plurality of lead fingers. The plurality of stud bumps may include a plurality of clusters of stud bumps.
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Alvarez Sheila Marie L.
Magno Sheila Rima C.
Shim Il Kwon
Ishimaru Mikio
Le Thao P.
Stats Chippac Ltd.
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