Semiconductor package with contact support layer and method...

Details Semiconductor package with contact support layer and method... Semiconductor package with contact support layer and method...

2006-08-10

2008-11-18

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S110000, C438S114000, C438S613000, C257SE21508

Reexamination Certificate

active

07452747

ABSTRACT:
A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.

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