Semiconductor package with conductor impedance selected...

Details Semiconductor package with conductor impedance selected... Semiconductor package with conductor impedance selected...

2006-11-07

2006-11-07

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S664000

Reexamination Certificate

active

07132740

ABSTRACT:
A semiconductor package having a plurality of conductors arrayed in two (or more) parallel planes, and an available ground conductor. Conductors in the auxiliary or second plane substantially overlay the primary signal conductors in the first plane, and the impedance of any lead or lead pair is arbitrarily set at the assembly process by connecting the auxiliary conductors to ground or by leaving them floating. Differential pairs of signal conductors, either odd or even mode are set by connecting the auxiliary conductors to a ground contact.

REFERENCES:
patent: 4626889 (1986-12-01), Yamamoto et al.
patent: 5925925 (1999-07-01), Dehaine et al.
patent: 6137168 (2000-10-01), Kirkman
patent: 6172305 (2001-01-01), Tanahashi
patent: 6201308 (2001-03-01), Ikegami et al.
patent: 6229209 (2001-05-01), Nakamura et al.
patent: 6563208 (2003-05-01), Lamson et al.

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