Semiconductor package with a mold material encapsulating a...

Details Semiconductor package with a mold material encapsulating a... Semiconductor package with a mold material encapsulating a...

2009-03-26

2011-12-06

Prasad, Chandrika (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

08072770

ABSTRACT:
Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.

REFERENCES:
patent: 5796160 (1998-08-01), Kozono
patent: 5963433 (1999-10-01), Kim
patent: 5999413 (1999-12-01), Ohuchi et al.
patent: 6861735 (2005-03-01), Minamio et al.
patent: 6900524 (2005-05-01), Minamio et al.
patent: 7679914 (2010-03-01), Kashiwazaki
patent: 2008/0074829 (2008-03-01), Kashiwazaki

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