Semiconductor package vertical mounting device and mounting meth

Details Semiconductor package vertical mounting device and mounting meth Semiconductor package vertical mounting device and mounting meth

1993-02-04

1996-12-03

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 491, 228212, 361718, B23K 308

Patent

active

055799876

ABSTRACT:
A method and apparatus for vertically mounting a semiconductor package is disclosed. The mounting apparatus has an extended (e.g. rectangular) shape, and is provided with a plurality of spaces adapted to receive and hold vertically semiconductor packages. To mount a semiconductor package in such a manner, the package is first inserted into a space in the apparatus provided therefor and fixedly held there. Next, a plurality of such semiconductor packages which are so held by the mounting apparatus are positioned on a printed circuit board, and their leads are soldered thereto to complete the mounting process. This facilitates both surface mounting and multi-layer wiring and decreases the potential for poor quality soldering. In addition, the mounting apparatus according to the present invention is beneficially heat dissipative, which helps to increase the life of a semiconductor package by heat which can cause deleterious thermal stresses.

REFERENCES:
patent: 3305705 (1967-02-01), Tillmanns et al.
patent: 3793720 (1974-02-01), Van Rijsewijk et al.
patent: 4638404 (1987-01-01), Grossmann et al.
patent: 4953283 (1990-09-01), Kawabata et al.
patent: 4983533 (1991-01-01), Go
patent: 5169347 (1992-12-01), Sang
patent: 5208733 (1993-05-01), Besanger

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