Semiconductor package using terminals formed on a conductive lay

Details Semiconductor package using terminals formed on a conductive lay Semiconductor package using terminals formed on a conductive lay

1998-06-11

2000-03-21

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257687, 257723, H01L 2302

Patent

active

060406224

ABSTRACT:
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.

REFERENCES:
patent: 5307240 (1994-04-01), McMahon
patent: 5315241 (1994-05-01), Ewers
patent: 5493151 (1996-02-01), Asada et al.
patent: 5663901 (1997-09-01), Wallace et al.
patent: 5796164 (1998-08-01), McGraw et al.

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