Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2006-05-09
2006-05-09
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S668000
Reexamination Certificate
active
07042104
ABSTRACT:
A semiconductor package and a method of manufacturing the same: The package includes a substrate, an external connection terminal portion on at least one edge thereof; a semiconductor chip bonded to the substrate, the semiconductor chip including a plurality of bonding pads; and a flexible film, which electrically connects the semiconductor chip to the external connection terminal portion. The flexible film includes an insulating film; a plurality of first terminals extending through the insulating film, the first terminals contacting external connection terminals of the external connection terminal portion; a plurality of second terminals extending through the insulating film and spaced a predetermined distance apart from the first terminals, the second terminals contacting the bonding pads; and conductive line patterns formed on a top surface of the insulating film, the conductive line patterns electrically connecting the first terminals to the second terminals that respectively correspond to the first terminals.
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Clark S. V.
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
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