Semiconductor package system with die support pad

Details Semiconductor package system with die support pad Semiconductor package system with die support pad

2011-03-22

2011-03-22

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S784000, C257SE23040

Reexamination Certificate

active

07911067

ABSTRACT:
A semiconductor package system includes: providing a lead frame with a lead; making a die support pad separately from the lead frame; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the lead; and connecting a bonding pad on the semiconductor die to the lead using a bonding wire.

REFERENCES:
patent: 5929514 (1999-07-01), Yalamanchili
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6894376 (2005-05-01), Mostafazadeh et al.
patent: 6927479 (2005-08-01), Ramakrishna
patent: 6943061 (2005-09-01), Sirinorakul et al.
patent: 7126218 (2006-10-01), Darveaux et al.
patent: 7161232 (2007-01-01), Lee et al.
patent: 7214562 (2007-05-01), Lum et al.
patent: 7288439 (2007-10-01), Mostafazadeh et al.
patent: 7298026 (2007-11-01), Shim et al.
patent: 7338841 (2008-03-01), Lau
patent: 7339257 (2008-03-01), Ozawa et al.
patent: 7365417 (2008-04-01), Camacho et al.
patent: 7419855 (2008-09-01), Lee et al.
patent: 2006/0210805 (2006-09-01), Mizuno
patent: 2007/0158792 (2007-07-01), Camacho et al.

Affiliated with

Also associated with

Rating

Semiconductor package system with die support pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package system with die support pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package system with die support pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2671122