Semiconductor package substrate with embedded resistors and...

Details Semiconductor package substrate with embedded resistors and... Semiconductor package substrate with embedded resistors and...

2006-11-14

2006-11-14

Quach, T. N. (Department: 2826)

Semiconductor device manufacturing: process

Making passive device

Resistor

C438S667000

Reexamination Certificate

active

07135377

ABSTRACT:
A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

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