Semiconductor package substrate with embedded resistors and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S537000, C257S581000, C438S382000, C438S384000, C438S381000, C438S238000

Reexamination Certificate

active

07323762

ABSTRACT:
A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

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