Semiconductor package structure for vertical mount and method

Details Semiconductor package structure for vertical mount and method Semiconductor package structure for vertical mount and method

2008-07-08

2008-07-08

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

C257S177000, C257S686000, C257S777000, C257SE23178

Reexamination Certificate

active

07397120

ABSTRACT:
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

REFERENCES:
patent: 6710996 (2004-03-01), Bobert et al.
patent: 7053474 (2006-05-01), Otremba
patent: 2002/0146860 (2002-10-01), Kinsman
patent: 2007/0075406 (2007-04-01), Ho et al.
patent: 2007/0090463 (2007-04-01), Xiaochun
patent: 2007/0200250 (2007-08-01), Koenigsberger et al.

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