Semiconductor package, semiconductor package module...

Details Semiconductor package, semiconductor package module... Semiconductor package, semiconductor package module...

2008-05-21

2010-06-29

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Beam leads

C257SE23001

Reexamination Certificate

active

07745932

ABSTRACT:
Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.

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Office Action dated Jun. 4, 2008 for corresponding Korean Application No. 10-2007-0060687.

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