Semiconductor package profile

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1988-03-02

1989-12-26

Hille, Rolf

357 68, H01L 2330, H01L 2304

Patent

active

048901547

ABSTRACT:
An improved package with J-leads for an integrated circuit is obtained by modifying the package profile so as to relieve the bottom edge to provide space for insertion of a rod to be used as a tool to shape or reshape the curved part of the leads. This permits both easier original manufacturing and faster and better reshaping of bent leads.

REFERENCES:
patent: 4617585 (1986-10-01), Yasui
patent: 4642670 (1987-02-01), Striny
patent: 4698660 (1987-10-01), Kubota et al.

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