Semiconductor package, printed circuit board, and electronic...

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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Details

C174S521000, C257S686000, C257S730000, C257S790000

Reexamination Certificate

active

07812265

ABSTRACT:
Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.

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patent: 6072122 (2000-06-01), Hosoya
patent: 6180881 (2001-01-01), Isaak
patent: 6392294 (2002-05-01), Yamaguchi
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patent: 6903464 (2005-06-01), Corisis
patent: 6951777 (2005-10-01), Fee et al.
patent: 7262074 (2007-08-01), Hall et al.
patent: 7633157 (2009-12-01), Jiang et al.
patent: 2007/0018299 (2007-01-01), Koo et al.
patent: 2009/0127687 (2009-05-01), Fan
patent: 2009/0127689 (2009-05-01), Ye et al.
patent: 2003-234436 (2003-08-01), None
patent: 2005-0104206 (2005-11-01), None
patent: 2005-0108198 (2005-11-01), None

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