Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-08-23
2011-08-23
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S687000, C257SE23061, C257SE21512, C438S768000
Reexamination Certificate
active
08004091
ABSTRACT:
A semiconductor package includes one or more semiconductor chips to form a semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and/or a molding member including a body that covers the first semiconductor chip and at least one extension that extends from the body. The extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package and including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted.
REFERENCES:
patent: 6867506 (2005-03-01), Barrett
patent: 2002/0025607 (2002-02-01), Danno et al.
patent: 2002/0130422 (2002-09-01), Venkateshwaran
patent: 2002/0175401 (2002-11-01), Huang et al.
patent: 2004/0135262 (2004-07-01), Masuda et al.
patent: 2005/0056919 (2005-03-01), Cobbley
patent: 2005/0194676 (2005-09-01), Fukuda et al.
patent: 2000-114427 (2000-04-01), None
patent: 2004-311668 (2004-11-01), None
Lee Seung-jae
Park Sang-Wook
Son Min-young
Yang Seung-yeol
Diallo Mamadou
Harness & Dickey & Pierce P.L.C.
Richards N Drew
Samsung Electronics Co,. Ltd.
LandOfFree
Semiconductor package, method of fabricating the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, method of fabricating the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, method of fabricating the same, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2738508