Semiconductor package lid with internal heat pipe

Details Semiconductor package lid with internal heat pipe Semiconductor package lid with internal heat pipe

1997-05-30

2000-10-17

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, H01L 2334

Patent

active

061336319

ABSTRACT:
The thermal resistance to lateral flow of heat flux through the lid of a semiconductor package may be reduced by incorporating one or more heat pipes into the lid itself. This has the further benefit of reducing the effective thermal resistance of the mechanical interface between the lid of the package and an external heat sink, owing to an increased area over which the heat flux is conducted. The result is a reduced temperature at the source of heat inside the semiconductor package.

REFERENCES:
patent: 4880052 (1989-11-01), Meyer, IV et al.
patent: 5323292 (1994-06-01), Brezinski
patent: 5355942 (1994-10-01), Conte
patent: 5880524 (1999-03-01), Xie
Anonymous: "Heat Pipe Spreader Plate" IBM TECHNICAL DISCLOSURE BULLETIN, vol. 26, No. 9, Feb. 1984 (1984-02), p. 4789 XP002116202 New York, US.

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