Semiconductor package, integrated circuit cards...

Details Semiconductor package, integrated circuit cards... Semiconductor package, integrated circuit cards...

2007-12-18

2010-06-01

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257S679000, C257S690000, C257S773000, C257S778000, C257SE23039, C257SE23065, C257SE23067, C257SE23176, C257SE21503

Reexamination Certificate

active

07728422

ABSTRACT:
One embodiment of a semiconductor package described herein includes a substrate having a first through-hole extending therethrough; a conductive pattern overlying the substrate and extending over the first through-hole; a first semiconductor chip facing the conductive pattern such that at least a portion of the first semiconductor chip is disposed within the first through-hole; and a first external contact terminal within the first through-hole and electrically connecting the conductive pattern to the first semiconductor chip.

REFERENCES:
patent: 6028774 (2000-02-01), Shin et al.
patent: 6288905 (2001-09-01), Chung
patent: 6365963 (2002-04-01), Shimada
patent: 2005/0161783 (2005-07-01), Hashimoto
patent: 2005/0189623 (2005-09-01), Akram et al.
patent: 2006/0091511 (2006-05-01), Kim et al.
patent: 2006/0261456 (2006-11-01), Steffen
patent: 2006/0292752 (2006-12-01), Connell et al.
patent: 07-276871 (1995-10-01), None
patent: 1998-043253 (1998-09-01), None
English language abstract of Japanese Publication No. 07-276871.
English language abstract of Korean Publication No. 1998-043253.

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