Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-01-11
2011-01-11
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257S531000, C343S70000R
Reexamination Certificate
active
07868462
ABSTRACT:
A semiconductor package comprises a package board and a plurality of semiconductor chips sequentially stacked on the package board. Each of the semiconductor chips comprises a semiconductor substrate and an open loop-shaped chip line formed on the semiconductor substrate. The open loop-shaped chip line has first and second end portions. The first and second end portions of the open loop-shaped chip lines are electrically connected to each other by connectors, and the connectors and the open loop-shaped chip lines constitute a spiral antenna.
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Choi Yun-seok
Lee Hee-Seok
Samsung Electronics Co,. Ltd.
Skyles Tifney L
Volentine & Whitt P.L.L.C.
Weiss Howard
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