Semiconductor package including transformer or antenna

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S686000, C257S531000, C343S70000R

Reexamination Certificate

active

07868462

ABSTRACT:
A semiconductor package comprises a package board and a plurality of semiconductor chips sequentially stacked on the package board. Each of the semiconductor chips comprises a semiconductor substrate and an open loop-shaped chip line formed on the semiconductor substrate. The open loop-shaped chip line has first and second end portions. The first and second end portions of the open loop-shaped chip lines are electrically connected to each other by connectors, and the connectors and the open loop-shaped chip lines constitute a spiral antenna.

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patent: 1243294 (2000-02-01), None
patent: 1482831 (2004-03-01), None
patent: 2676405 (2005-02-01), None
patent: 2005-159897 (2005-06-01), None
patent: 1020050090882 (2005-09-01), None

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