Semiconductor package including flip chip controller at...

Details Semiconductor package including flip chip controller at... Semiconductor package including flip chip controller at...

2011-01-11

2011-01-11

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S109000, C257SE23169, C257SE21614

Reexamination Certificate

active

07867819

ABSTRACT:
A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

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patent: 2006/0273442 (2006-12-01), Tsai et al.
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patent: 2007/0263425 (2007-11-01), Ruckerbauer
patent: 2008/0088005 (2008-04-01), Iwata

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