4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Suresh Upadhyayula

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Electrical connector with grounding pin

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate

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Electrical connector with grounding pin

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate

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Etched surface mount islands in a leadframe package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of assembling semiconductor devices with LEDs

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of assembling semiconductor devices with LEDS

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2295457

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