Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-12-05
2009-12-15
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S262000
Reexamination Certificate
active
07633765
ABSTRACT:
A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.
REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 3916434 (1975-10-01), Garboushian
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4532419 (1985-07-01), Takeda
patent: 4642160 (1987-02-01), Burgess
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4706167 (1987-11-01), Sullivan
patent: 4716049 (1987-12-01), Patraw
patent: 4786952 (1988-11-01), MacIver et al.
patent: 4806188 (1989-02-01), Rellick
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 4905124 (1990-02-01), Banjo et al.
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.
patent: 4974120 (1990-11-01), Kodai et al.
patent: 4996391 (1991-02-01), Schmidt
patent: 5021047 (1991-06-01), Movern
patent: 5072075 (1991-12-01), Lee et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5081520 (1992-01-01), Yoshii et al.
patent: 5091769 (1992-02-01), Eichelberger
patent: 5108553 (1992-04-01), Foster et al.
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5247429 (1993-09-01), Iwase et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5278726 (1994-01-01), Bernardoni et al.
patent: 5283459 (1994-02-01), Hirano et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5371654 (1994-12-01), Beaman et al.
patent: 5379191 (1995-01-01), Carey et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5508938 (1996-04-01), Wheeler
patent: 5530288 (1996-06-01), Stone
patent: 5531020 (1996-07-01), Durand et al.
patent: 5546654 (1996-08-01), Wojnarowski et al.
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5582858 (1996-12-01), Adamopoulos et al.
patent: 5616422 (1997-04-01), Ballard et al.
patent: 5637832 (1997-06-01), Danner
patent: 5674785 (1997-10-01), Akram et al.
patent: 5719749 (1998-02-01), Stopperan
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5739588 (1998-04-01), Ishida et al.
patent: 5742479 (1998-04-01), Asakura
patent: 5774340 (1998-06-01), Chang et al.
patent: 5784259 (1998-07-01), Asakura
patent: 5798014 (1998-08-01), Weber
patent: 5822190 (1998-10-01), Iwasaki
patent: 5826330 (1998-10-01), Isoda et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5847453 (1998-12-01), Uematsu et al.
patent: 5883425 (1999-03-01), Kobayashi
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5907477 (1999-05-01), Tuttle et al.
patent: 5936843 (1999-08-01), Ohshima et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 6004619 (1999-12-01), Dippon et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6021564 (2000-02-01), Hanson
patent: 6028364 (2000-02-01), Ogino et al.
patent: 6034427 (2000-03-01), Lan et al.
patent: 6040622 (2000-03-01), Wallace
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6069407 (2000-05-01), Hamzehdoost
patent: 6072243 (2000-06-01), Nakanishi
patent: 6081036 (2000-06-01), Hirano et al.
patent: 6119338 (2000-09-01), Wang et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6175087 (2001-01-01), Keesler et al.
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6194250 (2001-02-01), Melton et al.
patent: 6204453 (2001-03-01), Fallon et al.
patent: 6214641 (2001-04-01), Akram
patent: 6235554 (2001-05-01), Akram et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: D445096 (2001-07-01), Wallace
patent: D446525 (2001-08-01), Okamoto et al.
patent: 6274821 (2001-08-01), Echigo et al.
patent: 6280641 (2001-08-01), Gaku et al.
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6351031 (2002-02-01), Iijima et al.
patent: 6353999 (2002-03-01), Cheng
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6376906 (2002-04-01), Asai et al.
patent: 6392160 (2002-05-01), Andry et al.
patent: 6395578 (2002-05-01), Shin et al.
patent: 6405431 (2002-06-01), Shin et al.
patent: 6406942 (2002-06-01), Honda
patent: 6407341 (2002-06-01), Anstrom et al.
patent: 6407930 (2002-06-01), Hsu
patent: 6448510 (2002-09-01), Neftin et al.
patent: 6451509 (2002-09-01), Keesler et al.
patent: 6479762 (2002-11-01), Kusaka
patent: 6497943 (2002-12-01), Jimarez et al.
patent: 6517995 (2003-02-01), Jacobson et al.
patent: 6534391 (2003-03-01), Huemoeller et al.
patent: 6544638 (2003-04-01), Fischer et al.
patent: 6586682 (2003-07-01), Strandberg
patent: 6608757 (2003-08-01), Bhatt et al.
patent: 6660559 (2003-12-01), Huemoeller et al.
patent: 6715204 (2004-04-01), Tsukada et al.
patent: 6727645 (2004-04-01), Tsujimura et al.
patent: 6730857 (2004-05-01), Konrad et al.
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6740964 (2004-05-01), Sasaki
patent: 6753612 (2004-06-01), Adae-Amoakoh et al.
patent: 6774748 (2004-08-01), Ito et al.
patent: 6787443 (2004-09-01), Boggs et al.
patent: 6803528 (2004-10-01), Koyanagi
patent: 6815709 (2004-11-01), Clothier et al.
patent: 6815739 (2004-11-01), Huff et al.
patent: 6838776 (2005-01-01), Leal et al.
patent: 6888240 (2005-05-01), Towle et al.
patent: 6919514 (2005-07-01), Konrad et al.
patent: 6921968 (2005-07-01), Chung
patent: 6921975 (2005-07-01), Leal et al.
patent: 6953995 (2005-10-01), Farnworth et al.
patent: 7015075 (2006-03-01), Fay et al.
patent: 7030469 (2006-04-01), Mahadevan et al.
patent: 7081661 (2006-07-01), Takehara et al.
patent: 7125744 (2006-10-01), Takehara et al.
patent: 7198980 (2007-04-01), Jiang et al.
patent: 7242081 (2007-07-01), Lee
patent: 7282394 (2007-10-01), Cho et al.
patent: 7285855 (2007-10-01), Foong
patent: 7345361 (2008-03-01), Mallik et al.
patent: 7372151 (2008-05-01), Fan et al.
patent: 7429786 (2008-09-01), Karnezos et al.
patent: 2002/0017712 (2002-02-01), Bessho et al.
patent: 2002/0061642 (2002-05-01), Haji et al.
patent: 2002/0066952 (2002-06-01), Taniguchi et al.
patent: 2002/0195697 (2002-12-01), Mess et al.
patent: 2003/0025199 (2003-02-01), Wu et al.
patent: 2003/0128096 (2003-07-01), Mazzochette
patent: 2003/0141582 (2003-07-01), Yang et al.
patent: 2003/0197284 (2003-10-01), Khiang et al.
patent: 2004/0063246 (2004-04-01), Karnezos
patent: 2004/0145044 (2004-07-01), Sugaya et al.
patent: 2004/0159462 (2004-08-01), Chung
patent: 2005/0139985 (2005-06-01), Takahashi
patent: 2005/0242425 (2005-11-01), Leal et al.
patent: 2007/0273049 (2007-11-01), Khan et al.
patent: 2007/0290376 (2007-12-01), Zhao et al.
patent: 2008/0230887 (2008-09-01), Sun et al.
patent: 05-109975 (1993-04-01), None
patent: 05-136323 (1993-06-01), None
patent: 07-017175 (1995-01-01), None
patent: 08-190615 (1996-07-01), None
patent: 10-334205 (1998-12-01), None
IBM Technical Disclosure Bulletin, “Microstructure Solder Mask by Means of a Laser”, vol. 36, Issu
Huemoeller Ronald Patrick
Scanlan Christopher Marc
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Reichard Dean A.
Semenenko Yuriy
LandOfFree
Semiconductor package including a top-surface metal layer... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package including a top-surface metal layer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package including a top-surface metal layer... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4148498