Semiconductor package having semiconductor chip mounted on board

Details Semiconductor package having semiconductor chip mounted on board Semiconductor package having semiconductor chip mounted on board

1996-05-30

1997-10-14

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257783, 257781, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

056775750

ABSTRACT:
The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.

REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5468995 (1995-11-01), Higgins, III
patent: 5523622 (1996-06-01), Harada et al.

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