Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent
1993-03-04
1995-06-13
Prenty,, Mark
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
257 79, 257 80, 257 81, 257 82, 257116, 257117, 257432, 257433, H01L 29161, H01L 29205, H01L 29225, H01L 3300
Patent
active
054245737
ABSTRACT:
A semiconductor package includes a semiconductor chip, an interconnection substrate having the semiconductor chip mounted on one surface of the interconnection substrate, and a package base having the interconnection substrate mounted on one surface of the package base. An optical transmission medium is provided on the package base at a location corresponding to an optical device provided on the interconnection substrate. On the other surface of the package base is provided a receptacle for making an optical connection between an optical fiber cable and the optical transmission medium. Signals are input and/or output via the optical fiber cable connected to the receptacle.
REFERENCES:
patent: 4820013 (1989-04-01), Fuse
patent: 5047835 (1991-09-01), Chang
"41th Electronic Components & Technology Conference" (1991), pp. 234-244.
"Bear Chip Mounting using COB and TAB-Recent Technology Development and means for Improving Reliability (1990)", pp. 285-287.
Kato Takeshi
Mizuishi Kenichi
Tanaka Katsuya
Hitachi , Ltd.
Jr. Carl Whitehead
Prenty Mark
LandOfFree
Semiconductor package having optical interconnection access does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package having optical interconnection access, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having optical interconnection access will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1311466