Semiconductor package having multiple embedded chips

Details Semiconductor package having multiple embedded chips Semiconductor package having multiple embedded chips

2007-01-30

2007-01-30

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S686000, C257S723000, C327S518000

Reexamination Certificate

active

10803043

ABSTRACT:
A semiconductor package includes multiple embedded chips, each chip including a common circuit having substantially the same common function. The common circuit in a selected one of the chips is enabled. The common circuit in one or more other ones of the chips is disabled. As a result, the enabled common circuit performs the common function for the selected chip and the one or more other chips.

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Korean Office Action dated Sep. 30, 2005.
German Patent Office Action dated Feb. 24, 2006 for corresponding German patent application No. 102004029844.0-33.

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