Semiconductor package having memory devices stacked on logic...

Details Semiconductor package having memory devices stacked on logic... Semiconductor package having memory devices stacked on logic...

2008-08-12

2010-11-16

Auduong, Gene N. (Department: 2827)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S725000, C257S737000, C257S738000, C365S051000

Reexamination Certificate

active

07834450

ABSTRACT:
A semiconductor package includes a base substrate, a logic device with a serializer/deserializer (SerDes), a plurality of odd memory devices disposed on a lower surface of the logic device and operatively stack-connected with the SerDes, and a plurality of even memory devices disposed on an upper surface of the logic device and operatively stack-connected with the SerDes, such that the plurality of odd memory devices and the plurality of even memory devices are connected in parallel by the SerDes.

REFERENCES:
patent: 3461431 (1969-08-01), Ellinger et al.
patent: 5682062 (1997-10-01), Gaul
patent: 6683374 (2004-01-01), Hagen et al.
patent: 2005/0170600 (2005-08-01), Fukuzo
patent: 2010/0091537 (2010-04-01), Best et al.
patent: 2003060153 (2003-02-01), None
patent: 2007036104 (2007-02-01), None
patent: 1020060053168 (2006-05-01), None

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