Semiconductor package having interdigitated leads

Details Semiconductor package having interdigitated leads Semiconductor package having interdigitated leads

1995-06-07

1997-02-04

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257692, 257696, 257723, H01L 2348, H01L 2352

Patent

active

056001789

ABSTRACT:
The invention discloses a semiconductor package having two rows of interdigitated leads. The two rows of leads (14, 16) are affixed on and extend from one side of the semiconductor package (10). The two rows of leads (14, 16) are interdigitated with each other in a non-contacting manner. The end portions of the leads (17) are further shaped to form a contact surface for soldering to electrical conductors on a printed circuit board.

REFERENCES:
patent: 5446317 (1995-08-01), Sato et al.

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