Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-01
2006-08-01
Tran, Thien F. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S720000, C257S787000, C257S796000
Reexamination Certificate
active
07084494
ABSTRACT:
A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.
REFERENCES:
patent: 6933602 (2005-08-01), Patel et al.
Boyd William D.
Coyle Anthony L.
Haga Chris
Swanson Leland S.
Brady III Wade James
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tran Thien F.
Tung Yingsheng
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