Semiconductor package having enhanced heat dissipation and...

Details Semiconductor package having enhanced heat dissipation and... Semiconductor package having enhanced heat dissipation and...

2008-06-17

2008-06-17

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S712000, C257S713000, C257S796000, C257SE33075, C257SE31131, C257SE23051, C257SE23080, C257SE23082, C257SE23101, C257SE23109

Reexamination Certificate

active

07388286

ABSTRACT:
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided.

REFERENCES:
patent: 5184211 (1993-02-01), Fox
patent: 5786635 (1998-07-01), Alcoe et al.
patent: 6046498 (2000-04-01), Yoshikawa
patent: 7075180 (2006-07-01), Narendra et al.
patent: 1020000059991 (2000-10-01), None
patent: 1020030092538 (2003-12-01), None

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