Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2005-05-10
2005-05-10
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S796000, C257S719000, C257S732000, C257S717000
Reexamination Certificate
active
06891259
ABSTRACT:
A semiconductor package including a dam and a method for fabricating the same are provided. The semiconductor package comprises a package substrate, a semiconductor chip attached to the substrate, a TIM formed on the semiconductor chip, a dam that substantially surrounds the TIM, and a lid placed over the TIM to contact a surface thereof. Thus, a TIM can be prevented from flowing down from the original position at high temperatures. Therefore, the performance of the semiconductor package does not deteriorate even at high temperatures.
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Im Yun-Hyeok
Ro Young-Hoon
Flynn Nathan J.
Mandala Jr. Victor A.
Marger Johnson & McCollom PC
Samsung Electronics Co,. Ltd.
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