Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-02-21
2006-02-21
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S737000, C257S678000
Reexamination Certificate
active
07002245
ABSTRACT:
A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An encapsulation body encapsulates the chip and conductive bumps while exposing ends of the conductive bumps. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the exposed ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings for exposing predetermined portions of the conductive traces. The exposed portions of the conductive traces are connected to a plurality of solder balls respectively.
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Hsiao Cheng-Hsu
Huang Chien-Ping
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Owens Douglas W
Siliconware Precicion Industries Co., Ltd.
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