Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-08-30
2011-08-30
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S723000, C257SE23169
Reexamination Certificate
active
08008765
ABSTRACT:
A semiconductor package includes a first substrate comprising a plurality of pads arranged in a first side of the first substrate, a plurality of first semiconductor chips stacked on the first side of the first substrate and each first semiconductor chip comprising a plurality of chip pads arranged in a first side of respective first semiconductor chips, and a sealant arranged on the first substrate, the sealant sealing the first semiconductor chips, wherein at least one of the first semiconductor chips comprises a plurality of redistribution pads arranged in the first side of the at least one semiconductor chip, and a plurality of adhesive layers having portions exposed by the sealant, each adhesive layer is disposed on respective redistribution pads.
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F. Chau & Associates LLC
Parekh Nitin
Samsung Electronics Co,. Ltd.
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