Active solid-state devices (e.g. – transistors – solid-state diode – Superconductive contact or lead – Transmission line or shielded
Reexamination Certificate
2007-10-09
2007-10-09
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Superconductive contact or lead
Transmission line or shielded
C257S643000, C257S773000, C257S693000, C257SE23034, C257SE23055, C257SE23065
Reexamination Certificate
active
11143641
ABSTRACT:
A semiconductor package including a flexible tape having a mounting portion and an extended portion, a plurality of arrayed connection electrodes provided on the mounting portion of the flexible tape, and a semiconductor chip mounted on the mounting portion of the flexible tape. The semiconductor package further includes a high-speed signal electrode formed at the front end of the extended portion of the flexible tape, and a transmission line provided on the flexible tape for connecting the semiconductor chip and the high-speed signal electrode. A stiffener is mounted on the mounting portion of the flexible tape.
REFERENCES:
patent: 5760465 (1998-06-01), Alcoe et al.
patent: 5767528 (1998-06-01), Sumi et al.
patent: 6882042 (2005-04-01), Zhao et al.
patent: 9-82877 (1997-03-01), None
patent: 9-181215 (1997-07-01), None
patent: 10-270600 (1998-10-01), None
patent: 2000-232197 (2000-08-01), None
patent: 2000-243870 (2000-09-01), None
patent: 2001-77236 (2001-03-01), None
patent: P2002-16167 (2002-01-01), None
Clark Jasmine
Fujitsu Limited
LandOfFree
Semiconductor package having a high-speed signal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package having a high-speed signal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having a high-speed signal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3887307