Semiconductor package having a heat slug

Details Semiconductor package having a heat slug Semiconductor package having a heat slug

1999-03-17

2000-06-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361705, 361717, 257622, 257706, 257767, 257792, 165 803, 165185, 174 163, H05K 720

Patent

active

060814268

ABSTRACT:
A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor package comprises a circuit board having respective surfaces and an opening; a conductive layer formed on one of the surfaces of the circuit board so that the conductive layers are retracted from a peripheral edge of the opening by a certain distance; a heat slug attached to the one surface of the circuit board by means of solder so that the opening is closed at the one surface and opened at the other surface to form a cavity within which a semiconductor element mounting area is defined.

REFERENCES:
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 5235211 (1993-08-01), Hamburgen
patent: 5478420 (1995-12-01), Gauci et al.
patent: 5481138 (1996-01-01), Economicos et al.
patent: 5622588 (1997-04-01), Weber

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