Semiconductor package for efficient heat spreading

Details Semiconductor package for efficient heat spreading Semiconductor package for efficient heat spreading

2005-11-08

2005-11-08

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S675000, C257S706000, C257S712000, C257S787000

Reexamination Certificate

active

06963141

ABSTRACT:
The package of the present invention includes a chip located on a substrate with signal transferring device electrically connected between them. Solder balls connect the substrate and thus electrically connect the substrate to external circuits. Molding compound is covered to protect the chip and signal transferring means. The heat-slug is capped over the molding compound through a conductive glue. The entire area of the upper surface of the heat-slug is exposed to the ambient to improve the ability to spread heat.

REFERENCES:
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5609315 (1997-03-01), Lepore, Jr.
patent: 6146921 (2000-11-01), Barrow
patent: 6206997 (2001-03-01), Egitto et al.

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