Semiconductor package embedded in substrate, system...

Details Semiconductor package embedded in substrate, system... Semiconductor package embedded in substrate, system...

2011-02-15

2011-02-15

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

07888785

ABSTRACT:
A device includes a base substrate, a package including an encapsulated die, the package at least partially embedded in the base substrate, and a wiring portion on the package and extending across at least a portion of the base substrate adjacent to the package.

REFERENCES:
patent: 3368113 (1968-02-01), Shaunfield
patent: 3431468 (1969-03-01), Huffman
patent: 3440498 (1969-04-01), Mitchell
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 6943443 (2005-09-01), Nobori et al.
patent: 7087991 (2006-08-01), Chen et al.
patent: 7205674 (2007-04-01), Huang et al.

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