Semiconductor package consisting of multiple conductive layers

Details Semiconductor package consisting of multiple conductive layers Semiconductor package consisting of multiple conductive layers

1998-06-29

2000-06-27

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257690, 257684, 257692, 257676, 438123, H01C 2312, H01C 23495, H01C 2352

Patent

active

060810319

ABSTRACT:
An electronic component includes a substrate (301, 801), a leadframe (101, 601, 710) coupled to a first surface of the substrate (301, 801) and extending beyond the first surface and towards a second surface of the substrate (301, 801), and an electrically conductive layer coupled to the second surface and coplanar with a contact portion of the leadframe (101, 601, 710) where the leadframe (101, 601, 710) and the electrically conductive layer form a package around the substrate (301, 801).

REFERENCES:
patent: 4486945 (1984-12-01), Aigoo
patent: 5049977 (1991-09-01), Sako
patent: 5214307 (1993-05-01), Davis
patent: 5606199 (1997-02-01), Yoshigai
R. Tummala et al., Microelectronics Packaging Handbook, "Chip-To-Package Interconnections", 1989, pp. 409-435.

Affiliated with

Also associated with

Rating

Semiconductor package consisting of multiple conductive layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package consisting of multiple conductive layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package consisting of multiple conductive layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1786749