Semiconductor package and semiconductor system in package...

Details Semiconductor package and semiconductor system in package... Semiconductor package and semiconductor system in package...

2011-03-08

2011-03-08

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S690000, C257SE23001, C438S106000, C438S127000

Reexamination Certificate

active

07902652

ABSTRACT:
Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.

REFERENCES:
patent: 5357674 (1994-10-01), Lumbard
patent: 2001/0038151 (2001-11-01), Takahashi et al.
patent: 2004-172157 (2004-06-01), None
patent: 2004-37561 (2004-05-01), None
patent: 2005-71825 (2005-07-01), None
patent: 2006-44288 (2006-05-01), None

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