Semiconductor package and method of fabricating the same

Details Semiconductor package and method of fabricating the same Semiconductor package and method of fabricating the same

2008-09-17

2010-11-30

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257SE25005, C257SE25006, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07843051

ABSTRACT:
Provided are a semiconductor device and a method of fabricating the same, and more particularly, a semiconductor package and a method of fabricating the semiconductor package. The semiconductor package includes a first package that comprises a first substrate, at least one first semiconductor chip stacked on the first substrate, and first conductive pads exposed on a top surface of the first substrate; a second package disposed below the first package such that the second package comprises a second substrate, at least one second semiconductor chip, and second conductive pads exposed on a bottom surface of the second substrate; and a connection unit that extends from the first conductive pads to the second conductive pads such that the connection unit covers a side surface of the first package and a side surface of the second package in order to electrically connect the first package to the second package.

REFERENCES:
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patent: 5281852 (1994-01-01), Normington
patent: 5313096 (1994-05-01), Eide
patent: 5835988 (1998-11-01), Ishii
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6703651 (2004-03-01), Worz et al.
patent: 7126829 (2006-10-01), Yen
patent: 61-101067 (1986-05-01), None

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