Semiconductor package and method of assembling the same

Details Semiconductor package and method of assembling the same Semiconductor package and method of assembling the same

2007-06-11

2010-12-14

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S686000, C257SE25013

Reexamination Certificate

active

07851261

ABSTRACT:
An encapsulated semiconductor package includes a substrate including a chip mounting area and inner contact pads on its upper surface and at least two semiconductor chips, each having an active surface with a plurality of chip contact pads and a passive surface. A first semiconductor chip is mounted on the chip mounting area. A spacer block including a first and a second mounting face lying in essentially parallel planes is positioned between and attached to the first semiconductor chip and a second semiconductor chip. The mounting faces of the spacer block have a rounded outline.

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