Semiconductor package and method for manufacturing the same

Details Semiconductor package and method for manufacturing the same Semiconductor package and method for manufacturing the same

2009-09-24

2011-11-08

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23193, C257S777000

Reexamination Certificate

active

08053881

ABSTRACT:
A semiconductor package includes a first package including at least one first semiconductor chip; a second package including an external connection terminal and at least one second semiconductor chip, the second package being stacked on the first package; and an interposer disposed between the first and second packages and connected to the external connection terminal to electrically connect the first and second packages to each other. The interposer comprises an intermediate connector having an exposed end portion to which the second package is electrically connected via the external connection terminal and a protruding end portion lower than the exposed end portion to which the first package is electrically connected.

REFERENCES:
patent: 7298033 (2007-11-01), Yoo
patent: 2004/0113275 (2004-06-01), Karnezos
patent: 2004/0262734 (2004-12-01), Yoo
patent: 2006/0244157 (2006-11-01), Carson
patent: 2008/0042253 (2008-02-01), Yoo
patent: 2010/0033941 (2010-02-01), Pagaila et al.
patent: 2005-26680 (2005-01-01), None
patent: 10-2005-0027384 (2005-03-01), None
patent: 10-0604821 (2006-07-01), None

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