Semiconductor package and method for manufacturing the same

Details Semiconductor package and method for manufacturing the same Semiconductor package and method for manufacturing the same

2008-05-06

2008-05-06

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000, C257SE21599, C257SE21641

Reexamination Certificate

active

11828699

ABSTRACT:
A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.

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patent: 2001-351997 (2001-12-01), None

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