Semiconductor package and method for manufacturing the same

Details Semiconductor package and method for manufacturing the same Semiconductor package and method for manufacturing the same

2006-05-02

2006-05-02

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S620000, C257S734000, C257S738000

Reexamination Certificate

active

07037759

ABSTRACT:
A semiconductor package comprises a semiconductor chip, a lid, a plurality of traces, a compliant layer, a plurality of conductive pastes, and a plurality of solder pads. The semiconductor chip has an active surface, a backside, and a plurality of bonding pads disposed on the active surface. The lid covers the active surface of the semiconductor chip. The traces are disposed between the lid and the active surface of the semiconductor chip, and are electrically connected to the bonding pads. The compliant layer covers the backside of the semiconductor chip for isolating the traces. The conductive pastes are electrically connected to the traces, and the solder pads are electrically connected to the conductive pastes.

REFERENCES:
patent: 5998238 (1999-12-01), Kosaki
patent: 6040235 (2000-03-01), Badehi
patent: 6117707 (2000-09-01), Badehi
patent: 6316287 (2001-11-01), Zandman et al.
patent: 6399463 (2002-06-01), Glenn et al.
patent: 6790694 (2004-09-01), Sugiyama et al.
patent: 2003/0190795 (2003-10-01), Kawakami
patent: 2003/0209772 (2003-11-01), Prabhu
patent: 2003/0216010 (2003-11-01), Atlas

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