Semiconductor package and method for fabricating the same

Details Semiconductor package and method for fabricating the same Semiconductor package and method for fabricating the same

1996-12-11

1999-01-12

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438113, 438118, 438123, 438124, 438126, 438129, 438461, 438611, 438615, 438618, H01L 2156, H01L 2158, H01L 2160

Patent

active

058588159

ABSTRACT:
A process for manufacturing chip size semiconductor package with a light, thin, and compact structure having a reduced size of its semiconductor chip while having an increased number of pins For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.

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