Semiconductor package and manufacturing method thereof

Details Semiconductor package and manufacturing method thereof Semiconductor package and manufacturing method thereof

2006-04-04

2006-04-04

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000

Reexamination Certificate

active

07023082

ABSTRACT:
A semiconductor package mainly comprises a substrate unit and a chip. The chip is electrically connected to the substrate unit. The substrate unit includes an upper surface, a lower surface and a side surface. A plurality of circuit traces are formed on the upper surface and a plurality of contacts are formed on the side surface, wherein the contacts are electrically connected to the circuit traces. Besides, a plurality of solder balls are formed on the contacts in order to transmit the signals from chip to outside through the substrate unit, the contacts and the solder balls. Furthermore, a semiconductor package module will be formed by electrically connecting the semiconductor packages with each other through solder balls and a module substrate, and mounting the semiconductor packages with each other through an adhesive layer. In addition, a method for manufacturing the semiconductor package is disclosed.

REFERENCES:
patent: 3311791 (1967-03-01), Larson et al.
patent: 6566747 (2003-05-01), Ohuchi et al.
patent: 2004/0094832 (2004-05-01), Tao

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