Semiconductor package and fabrication method thereof

Details Semiconductor package and fabrication method thereof Semiconductor package and fabrication method thereof

2011-04-05

2011-04-05

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S700000, C257SE23123

Reexamination Certificate

active

07919853

ABSTRACT:
A semiconductor package and method of manufacture has a substrate having an aperture. A semiconductor die is positioned in the aperture of the substrate and attached to a heat spreader by a first adhesive and electrically coupled to the substrate by at least one conductive wire. The heat spreader spans the aperture and is peripherally attached to a bottom surface of the substrate by a second adhesive. An encapsulant encapsulates the aperture, the semiconductor die, and the electrically conductive wire.

REFERENCES:
patent: 5801435 (1998-09-01), Otsuki
patent: 5903052 (1999-05-01), Chen et al.
patent: 2004/0195685 (2004-10-01), Chiu et al.

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