Semiconductor package and assembly for fabricating the same

Details Semiconductor package and assembly for fabricating the same Semiconductor package and assembly for fabricating the same

1998-01-16

1999-11-02

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257783, 257780, 257784, 257787, H01L 23053, H01L 2312, H01L 2348, H01L 2352

Patent

active

059776242

ABSTRACT:
A chip size semiconductor package with a light, thin, simple and compact structure having a reduced size of its semiconductor chip while having an increased number of pins and without degrading its functions. For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.

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