Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-03-07
1995-09-12
Sparks, Donald A.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257692, 257696, 257723, 257779, 361760, 361772, 361761, 361764, 361777, 361779, 361783, 439 68, 439 72, 439 78, 439 82, 439 83, H01R 900, H05K 118, H05K 702
Patent
active
054502896
ABSTRACT:
An arrangement for vertically mounting a semiconductor device to a substrate, e.g., a printed circuit board (PCB), in which a plurality of sequentially arranged external leads of the semiconductor device include at least three different sets of non-consecutive ones of the external leads which have laterally outwardly extending foot portions lying in respective, vertically spaced-apart planes, and in which the foot portions of first and second ones of the sets of non-consecutive external leads are respectively secured to respective first and second steps formed in one of a plurality of walls defining a cavity in the PCB, and a third set of the non-consecutive external leads are secured to a portion of a major surface of the PCB adjacent the cavity.
REFERENCES:
patent: 4125740 (1978-11-01), Paletto
IBM Technical Disclosure Bulletin "Surface-mounted Device On Circuitized Thermoformable Sheets" vol. 28 No. 5 Oct. 1985 pp. 2068 and 2069.
An Min C.
Kweon Yooung D.
Donohoe Charles R.
Samsung Electronics Co,. Ltd.
Sparks Donald A.
Westerlund Robert A.
Whitt Stephen R.
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